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Yissum Announces New Platform for 3D Printing of Personalized Medicine

Betty Tűndik

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Reading Time: 2 minutes

 

Technology to be presented at the 3D Printing and Beyond Conference at The Hebrew University of Jerusalem on November 7, 2018

Yissum, the Technology Transfer Company of The Hebrew University announced a novel technology for the 3D printing of drug capsules. The technology is based on custom-printed 3D hydrogels with delayed release characteristics. The technology will be presented at the 2nd annual conference, 3d Printing and Beyond, November 7, 2018, at the Hebrew University in Jerusalem.

Professor Shlomo Magdassi, head of the Hebrew University’s 3D and Functional Printing Center, as well as a member of the Center for Nanoscience and Nanotechnology and Institute of Chemistry, in collaboration with Dr. Ofra Benny, researcher at Hebrew University’s Institute for Drug Research, developed the cutting edge drug fabrication technology which enables a complex design of drug delivery systems, currently unavailable in conventional pharmaceutical manufacturing techniques. This approach enables printing customized and personalized medications out of hydrogel objects which can expand, change shape, and activate on a delayed schedule.

Besides the ability to achieve complex structures and release profiles of drugs, this novel platform has the ability to personalize prescription medicines, allowing for doctors to tailor accurately the exposure and dosage levels for individual patients.

“Professor Magdassi and Dr. Benny’s research is an excellent example of the kind of interdisciplinary transformational inventions that originate from the Hebrew University. This technology is bringing us closer to a future in which the medical field can offer personalized, patient-centered care,” said Dr. Yaron Daniely, CEO and President of Yissum.

3D printed hydrogels are just one of many innovations that will be presented at the 2nd annual conference, 3D Printing and Beyond, which brings to Jerusalem a wide range of global industry leaders and researchers to explore advances in pharmaceuticals, electronics, and defense related technologies, along with 3D printed food, automotive parts and more.

3D Printing and Beyond is organized by Prof. Shlomo Magdassi and Dr. Michael Layani of the 3D and Functional Printing Center at the Center for Nanoscience and Nanotechnology, The Hebrew University of Jerusalem. The conference is sponsored by the Jerusalem Development Authority, Yissum, the Technology Transfer Company of The Hebrew University and The Hebrew University of Jerusalem.

I am a conscientious, open minded, adaptable to new experiences and ambitious person who likes to share interesting learning and news about lifestyle and particularly healthy vegan lifestyle. Through my studies I've obtained many naturopathic and nutrition degrees and my part-time roles have added marketing, network marketing, event management and store management skills to my experiences. I've gained knowledge of costumer relationship management, by maintaining the business relationships with the company's foreign client database. My online marketing and social media interactivity experience was gained when me and my husband started a business with an online/organic webshop & healthy lifestyle consultancy. I've improved my English at Cambridge Academy of English - 2003, in Cambridge. I live a conscious lifestyle, and try to protect the ecosystem. Animal lover and capable of helping others without judgement or negative reactions, this is thanked to my knowledge in holistic therapies and the naturopathy courses I've followed. I've also took part on Vegan Cooking and Raw Vegan short course in Budapest. I also had the opportunity BodyMind Institute's student in Canada. At this moment I'm also a student at International School, learning to have a diploma in recruitment and HR assessment. I cannot leave far my spiritual growth and the continuous development in alternative and holistic therapies, so I'm learning at Kyron School of New Consciousness, receiving a Bio Energo-therapist diploma. My Professional Goals include continuing to grow in knowledge and pursue a career in Management, health related retail or marketing, healthy lifestyle coaching and advisory, organisation and coordination, but I am every time open to new. You can read my stories, browse throught the news I write and edit daily, in the following categories: Cannabis, Health Care/Hospitals, Entertainment, Health & Lifestyle, Alternative Energies, Food & Beverages, Animals/Pets, Cosmetics and Personal Care, Alternative Medicine and many more. You can get in touch to discuss interviews or possible article submissions via e-mail on betty.tundik@picante.today or call our office number: 0040 731 394 220. Let's also connect via social media! You can find me on LinkedIn and Twitter.

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Computer Electronics

Vivo’s Elevating Front Camera is a Game Changer

Vlad Poptamas

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Captured from Vivo’s video about Elevating Front Camera - Source: Vivo
Reading Time: 1 minute

 

Vivo has had a fantastic year of launching true innovations in 2018. The company has recently published a video to showcase its industry-leading innovative solution — the Elevating Front Camera.

In the past, brands have tried shaving the side bezels and minimizing the size of the notch to achieve a full-screen display, but still the notch remains. For Vivo, it started to explore ways to breakthrough this status quo, aiming to create a bezel-less phone display experience for the consumers.

After years of researching and testing various designs, Vivo presented the APEX™ FullView™ concept smartphone with the iconic Elevating Front Camera at MWC 2018. The challenge for Vivo, was then to turn this concept phone, into a reality.

Just 4 months after the debut at MWC, Vivo delivered its promise to make the bezel-less dream come true with NEX – the first mass-produced smartphone with an Elevating Front Camera. This is a small periscopic camera that pops up when taking selfies, and retracts automatically when the user exits selfie mode. The true bezel-less phone was finally achieved.

Vivo has rewritten the rules of the smartphone industry by completely scraping the notch with this groundbreaking invention. With such an impressive technology now made available to consumers, Vivo is sure to take the Elevating Front Camera a step further in 2019.

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Computer Electronics

ZEISS Launches New High-resolution 3D X-ray Imaging Solutions for Advanced Semiconductor Packaging Failure Analysis

Vlad Poptamas

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Xradia 600-series Versa 3D X-ray Microscope
Reading Time: 4 minutes

 

New submicron and nanoscale XRM systems and new microCT system provide flexible options for implementing failure analysis to accelerate development and to improve assembly yields of advanced semiconductor packages

ZEISS today unveiled a new suite of high-resolution 3D X-ray imaging solutions for failure analysis (FA) of advanced semiconductor packages, including 2.5/3D and fan-out wafer-level packages. The new ZEISS systems include the Xradia 600-series Versa and Xradia 800 Ultra X-ray microscopes (XRM) for submicron and nanoscale package FA, respectively, as well as the new Xradia Context microCT. With the addition of these new systems to its existing family of products, ZEISS now provides the broadest portfolio of 3D X-ray imaging technologies serving the semiconductor industry.

“Throughout its 170-year history, ZEISS has pushed the frontiers of scientific research and advanced the start-of-the-art in imaging technologies to enable new industrial applications and technological innovations,” stated Dr. Raj Jammy, president, ZEISS Process Control Solutions (PCS) and Carl Zeiss SMT, Inc. “Now more than ever in the semiconductor industry, where package as well as device features are shrinking in all three dimensions, new imaging solutions are needed to quickly isolate failures in order to enable higher package yields. We are extremely pleased to announce this trio of new 3D X-ray imaging solutions for advanced semiconductor packaging, which provides our customers with a powerful high-resolution toolset to improve their failure analysis success rates.”

Advanced Packaging Requires New Defect Detection and Failure Analysis Methods
As the semiconductor industry approaches the limits of CMOS scaling, semiconductor packaging needs to help bridge the performance gap. To continue producing ever-smaller and faster devices with lower power requirements, the semiconductor industry is turning to package innovation through 3D stacking of chips and other novel packaging formats. This drives increasingly complex package architectures and new manufacturing challenges, along with increased risk of package failures. Furthermore, since the physical location of failures is often buried within these complex 3D structures, conventional methods for visualizing failure locations are becoming less effective. New techniques are required to efficiently isolate and determine the root cause of failures in these advanced packages.

To address these needs, ZEISS has developed a new suite of 3D X-ray imaging solutions that provides submicron and nanoscale 3D images of features and defects buried within intact structures in advanced package 3D architectures. This is enabled by rotating a sample and capturing a series of 2D X-ray images from different perspectives, followed by reconstruction of 3D volumes using sophisticated mathematical models and algorithms. An unlimited number of virtual cross-sections of the 3D volume may be viewed from any angle – providing valuable insight of failure locations prior to physical failure analysis (PFA). The combination of submicron and nanoscale XRM solutions from ZEISS provides a unique FA workflow that can significantly enhance FA success rates. ZEISS’s new Xradia Context microCT offers high contrast and resolution in a large field of view, using projection-based geometric magnification, and is fully upgradable to Xradia Versa.

New Imaging Solutions in Detail
Xradia 600-series Versa
is the next generation of 3D XRM for non-destructive imaging of localized defects within intact advanced semiconductor packages. It excels in structural and FA applications for process development, yield improvement and construction analysis. Based on the award-winning Versa platform with Resolution at a Distance (RaaD) capability, Xradia 600-series Versa offers unsurpassed performance for high-resolution imaging of larger samples at long working distances to determine root causes of defects and failures in packages, circuit boards and 300 mm wafers. It can easily visualize defects associated with package-level failures, such as cracks in bumps or microbumps, solder wetting problems or through silicon via (TSV) voids. The 3D visualization of defects prior to PFA reduces artifacts and guides cross-section orientations, leading to improved FA success rates. Features include:

  • 0.5 micron spatial resolution, 40 nm min voxel size
  • Up to 2x higher throughput than Xradia 500-series Versa, achieved while maintaining high resolution with excellent source spot-size stability and thermal management control across the full kV and power range
  • Improved ease of use, including fast-activation source control
  • Ability to observe submicron structural changes within a package successively imaged at multiple reliability test read points

Xradia 800 Ultra brings 3D XRM to the nanoscale realm, producing images of buried features with nanoscale spatial resolution while preserving the volume integrity of the region of interest. Applications include process analysis, construction analysis and defect analysis of ultra-fine-pitch flip chip and bump connections – enabling process improvement for ultra-fine-pitch package and back-end-of-line (BEOL) interconnects. Xradia 800 Ultra enables visualization of the texture and volume of solder consumed by intermetallic compounds in fine-pitch copper pillar microbumps. Defect sites are preserved during imaging, enabling targeted follow-up analysis by a variety of techniques. The construction quality of blind assemblies, such as wafer-to-wafer bonded interconnect and direct hybrid bonding, can be characterized in 3D. Features include:

  • 150 nm and 50 nm spatial resolution (sample preparation is required)
  • Optional pico-second laser sample prep tool, enabling extraction of an intact volume sample (typically 100 microns in diameter) in under one hour
  • Compatibility with a wide range of options for follow-on analysis, including transmission electronic microscopy (TEM), energy dispersive X-ray spectroscopy (EDS), atomic force microscopy (AFM), secondary ion mass spectroscopy (SIMS) and nanoprobing

Xradia Context microCT is a new submicron-resolution 3D X-ray microCT system based on the Versa platform. It is designed for high-resolution imaging of packages at short working distances with high throughput. Features include:

  • Large field of view for full-field imaging of large samples (10x greater volume compared to the Xradia Versa XRM system)
  • High-speed 6-megapixel detector with small pixel size maintains resolution at even relatively large fields of view
  • X-ray microCT with 0.95 micron spatial resolution, 0.5 micron min voxel size
  • Excellent image quality and contrast
  • Field convertible to Xradia Versa, enabling RaaD capability and high-resolution imaging of intact larger samples

ZEISS will showcase its latest microscopy products and solutions for semiconductor manufacturing – including the new Xradia 600-series Versa, Xradia 800 Ultra and Xradia Context microCT systems – at SEMICON Korea, to be held January 23-25 at the COEX Convention and Exhibition Center in Seoul, Korea. Attendees interested in learning more can visit ZEISS at Booth D520.

For more information on these new 3D X-ray imaging solutions from ZEISS, please visit: www.zeiss.com/pcs

 

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Banking/Financial Services

OKEx Launches Thai Baht (THB) and British Pound (GBP) OTC Trading

Vlad Poptamas

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OKEx Launches Thai Baht (THB) and British Pound (GBP) OTC Trading - Source: OKEx
Reading Time: 2 minutes

 

OKEx, the Malta-based world-leading digital asset exchange, announced to launch two new currencies – Thai Baht (THB) and British Pound (GBP) on its over-the-counter (OTC) trading platform (also referred to as fiat-to-cryptocurrency platform). Users in Thailand and the United Kingdom can now complete KYC verification to be eligible to trade on the OTC trading platform.

OKEx OTC trading allows users to place orders with self-selected exchange rate and payment methods to buy or sell Virtual Financial Assets with fiat currencies, which benefits them by offering a low-volatility market and zero transaction fee. Instead of the listing of the new currencies, Thai Baht (THB) and British Pound (GBP), OKEx OTC trading platform has already been facilitating global digital assets trading with the Vietnamese Dong (VND) and Chinese Renminbi (CNY) fiat-to-cryptocurrency markets, and more currencies are expected to come in at a later time this year. The Thai Baht (THB) and British Pound (GBP) OTC trading markets currently support BTC, USDT, ETH, and LTC.

“Our mission is simple at OKEx. We aim to offer flexibility and convenience to our traders. Thailand and the UK own the fastest growing crypto communities in the world. We see great potential in these two markets and want to support the needs there. Because of the increasing trading volume and number of traders in these two countries, we decided to launch the new THB and GBP trading services on our OTC trading platform. Wherever the market potential locates, we will expand to there. In 2019, you can expect more currencies will be supported on OKEx,” said Andy Cheung, OKEx’s Head of Operations.

OKEx OTC Network Launch Events and Promotions

To celebrate the launch, OKEx has come up with new incentives to encourage new sign-up for merchants and customers in Thailand and the UK. From January 23 to 27, newly registered customers can earn up to 50 USDT for making a minimum deposit of 100 USDT (or equivalent) and complete their first OTC transaction on OKEx, while the top 70 merchants with the most transaction volume will be rewarded 30 USDT (1 time per day).

In addition, the OKEx OTC Network Launch events will be hosted in Bangkok, Thailand on February 13, 2019 and London, UK in March respectively.

For more details, please refer to OKEx Twitter.

Risk Warning: Trading digital assets involves significant risk and can result in the loss of invested capital. Users should ensure that they fully understand the risk involved and take into consideration their level of experience, investment objectives and seek independent financial advice if necessary.

 

 

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