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Sterlite Tech combines network design innovation, service engineering with FTTx MANTRA™

Zoltán Tűndik

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This industry-first Fibre-to-the-Point service solution converges design capability, fiberisation and virtualisation, delivering massive agile FTTx networks faster

Sterlite Tech [BSE: 532374, NSE: STRTECH], a global data network solutions company, has announced the launch of its new – FTTx MANTRA™ – an end-to-end FTTx-as-a-service solution. This solution allows swift roll-out of Fibre-to-the-Point (FTTx) networks at the scale, latency and agility needed to suit all future requirements of 5G, Internet of Things (IoT) applications, for global communication service providers, data centres and citizen networks.

Uniting design innovation and expertise in service engineering onto a single technology platform, the Company’s indigenously developed FTTx MANTRA™ – Massive Agile Network Transformation – brings together the power of five Is: Ingenious optical-fibre products, Integrated network design, Innovative virtualisation, Inclusive approach to hyper-scale network deployment and Intelligent software solutions that use analytics and Big Data.

“For communication and digital service providers to meet the demand for data, fibre networks must be redesigned to be more agile with near-zero latency,” said Dr Anand Agarwal, Group CEO, Sterlite Tech. “While fibre provides a technology anchor for digital networks, a unified solution that converges design capability, deep fiberisation and virtualisation is the key to enabling ubiquitous connectivity to every home or enterprise. By integrating our silicon-to-software capabilities, we have created FTTx MANTRA™ as a solution which does exactly that. With this service, we are transforming everyday living experiences.”

Launching the high-tech solution, Anuj Jain, Business Head (FTTH and Enterprise), Jio, said: “Sterlite Tech has been our partner since inception. As we enhance our value proposition for our customers, Sterlite Tech as our network partner is enabling the reach of our digital solutions to the last mile. Such disruptive and integrated last-mile connectivity service offering enables us to connect everyone, everything, everywhere at the highest quality and the most affordable price. This is transforming the quality of life, improving productivity of the people of India.” Adding further, Jain asserted, “This FTTx MANTRA™ solution will help enable faster penetration of broadband in remote locations, bridging the digital divide between rural and urban India.”

As consumers’ expectations for a seamless user experience across all devices is on the rise, and with 5G, IoT, Virtual and Augmented Reality on the verge of disrupting the global data consumption, Sterlite Tech has developed this technology to ensure faster and easier fibre infrastructure roll-out to the customers’ end-point. This new hands-on technology assists early adopters to reduce time-to-market of consumer broadband services as well as capital and operational costs of network deployment.

Co-founder, Editor - After accumulating enough experience by launching and building a successful media and events organizer company in the gaming industry, the opportunity to also move into more verticals just came naturally. I have hunger for knowledge and like to report on technology and news that are not picked up by main stream media channels because they don't produce enough emotions. Make sure you subscribe to read our hand picked news which you will only find on PICANTE!

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General Sports

adidas India is all Set to Celebrate Future Tennis Champions

Vlad Poptamas

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Photo source: roppongihills.com
Reading Time: 1 minute

 

adidas, today announced the launch of adidas Creators Tennis Open in India. Aligned to the brand philosophy, adidas continues to encourage and nurture grassroots Tennis in India by bolstering budding tennis players to show and test their skills with the best in the league. The Tennis tournament will deliver a brand new and inspiring concept enabling young tennis players to participate and learn under the guidance of ace Tennis coach, Aditya Sachdeva. adidas Creators Tennis Open will be held from 24th January-27th January, 2019 in New Delhi.

adidas believes in the power of an athlete’s imagination and creativity to make a difference in their game, life and world. adidas Creators Tennis Open will offer an authentic yet enthralling experience to young tennis players and enthusiasts. The four-day tournament will be organised at the Panchsheel Club in New Delhi with close to 250 participants and players between 08yrs-16yrs and men’s singles and doubles.

Speaking on adidas’ commitment on changing the outlook towards the young players, Sharad Singla, Head – Activation, adidas India said, “We believe through sport, we have the power to change lives. adidas creators is one such platform where young creators can unite, explore their creativity and take a step closer to their dream. adidas is committed to nurturing introduce concepts that get established in the sporting calendar for the youth. We are privileged to witness some fantastic tennis from potential stars of the future.”

adidas has consistently invested and created new opportunities to boost and nurture grassroots sports in India, it has inspired athletes through initiatives like the FC Bayern Youth Cup, adidas Tango League, adidas Football The Base and now, adidas Creators Tennis Open.

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Computer Electronics

Vivo’s Elevating Front Camera is a Game Changer

Vlad Poptamas

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Captured from Vivo’s video about Elevating Front Camera - Source: Vivo
Reading Time: 1 minute

 

Vivo has had a fantastic year of launching true innovations in 2018. The company has recently published a video to showcase its industry-leading innovative solution — the Elevating Front Camera.

In the past, brands have tried shaving the side bezels and minimizing the size of the notch to achieve a full-screen display, but still the notch remains. For Vivo, it started to explore ways to breakthrough this status quo, aiming to create a bezel-less phone display experience for the consumers.

After years of researching and testing various designs, Vivo presented the APEX™ FullView™ concept smartphone with the iconic Elevating Front Camera at MWC 2018. The challenge for Vivo, was then to turn this concept phone, into a reality.

Just 4 months after the debut at MWC, Vivo delivered its promise to make the bezel-less dream come true with NEX – the first mass-produced smartphone with an Elevating Front Camera. This is a small periscopic camera that pops up when taking selfies, and retracts automatically when the user exits selfie mode. The true bezel-less phone was finally achieved.

Vivo has rewritten the rules of the smartphone industry by completely scraping the notch with this groundbreaking invention. With such an impressive technology now made available to consumers, Vivo is sure to take the Elevating Front Camera a step further in 2019.

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Computer Electronics

ZEISS Launches New High-resolution 3D X-ray Imaging Solutions for Advanced Semiconductor Packaging Failure Analysis

Vlad Poptamas

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Xradia 600-series Versa 3D X-ray Microscope
Reading Time: 4 minutes

 

New submicron and nanoscale XRM systems and new microCT system provide flexible options for implementing failure analysis to accelerate development and to improve assembly yields of advanced semiconductor packages

ZEISS today unveiled a new suite of high-resolution 3D X-ray imaging solutions for failure analysis (FA) of advanced semiconductor packages, including 2.5/3D and fan-out wafer-level packages. The new ZEISS systems include the Xradia 600-series Versa and Xradia 800 Ultra X-ray microscopes (XRM) for submicron and nanoscale package FA, respectively, as well as the new Xradia Context microCT. With the addition of these new systems to its existing family of products, ZEISS now provides the broadest portfolio of 3D X-ray imaging technologies serving the semiconductor industry.

“Throughout its 170-year history, ZEISS has pushed the frontiers of scientific research and advanced the start-of-the-art in imaging technologies to enable new industrial applications and technological innovations,” stated Dr. Raj Jammy, president, ZEISS Process Control Solutions (PCS) and Carl Zeiss SMT, Inc. “Now more than ever in the semiconductor industry, where package as well as device features are shrinking in all three dimensions, new imaging solutions are needed to quickly isolate failures in order to enable higher package yields. We are extremely pleased to announce this trio of new 3D X-ray imaging solutions for advanced semiconductor packaging, which provides our customers with a powerful high-resolution toolset to improve their failure analysis success rates.”

Advanced Packaging Requires New Defect Detection and Failure Analysis Methods
As the semiconductor industry approaches the limits of CMOS scaling, semiconductor packaging needs to help bridge the performance gap. To continue producing ever-smaller and faster devices with lower power requirements, the semiconductor industry is turning to package innovation through 3D stacking of chips and other novel packaging formats. This drives increasingly complex package architectures and new manufacturing challenges, along with increased risk of package failures. Furthermore, since the physical location of failures is often buried within these complex 3D structures, conventional methods for visualizing failure locations are becoming less effective. New techniques are required to efficiently isolate and determine the root cause of failures in these advanced packages.

To address these needs, ZEISS has developed a new suite of 3D X-ray imaging solutions that provides submicron and nanoscale 3D images of features and defects buried within intact structures in advanced package 3D architectures. This is enabled by rotating a sample and capturing a series of 2D X-ray images from different perspectives, followed by reconstruction of 3D volumes using sophisticated mathematical models and algorithms. An unlimited number of virtual cross-sections of the 3D volume may be viewed from any angle – providing valuable insight of failure locations prior to physical failure analysis (PFA). The combination of submicron and nanoscale XRM solutions from ZEISS provides a unique FA workflow that can significantly enhance FA success rates. ZEISS’s new Xradia Context microCT offers high contrast and resolution in a large field of view, using projection-based geometric magnification, and is fully upgradable to Xradia Versa.

New Imaging Solutions in Detail
Xradia 600-series Versa
is the next generation of 3D XRM for non-destructive imaging of localized defects within intact advanced semiconductor packages. It excels in structural and FA applications for process development, yield improvement and construction analysis. Based on the award-winning Versa platform with Resolution at a Distance (RaaD) capability, Xradia 600-series Versa offers unsurpassed performance for high-resolution imaging of larger samples at long working distances to determine root causes of defects and failures in packages, circuit boards and 300 mm wafers. It can easily visualize defects associated with package-level failures, such as cracks in bumps or microbumps, solder wetting problems or through silicon via (TSV) voids. The 3D visualization of defects prior to PFA reduces artifacts and guides cross-section orientations, leading to improved FA success rates. Features include:

  • 0.5 micron spatial resolution, 40 nm min voxel size
  • Up to 2x higher throughput than Xradia 500-series Versa, achieved while maintaining high resolution with excellent source spot-size stability and thermal management control across the full kV and power range
  • Improved ease of use, including fast-activation source control
  • Ability to observe submicron structural changes within a package successively imaged at multiple reliability test read points

Xradia 800 Ultra brings 3D XRM to the nanoscale realm, producing images of buried features with nanoscale spatial resolution while preserving the volume integrity of the region of interest. Applications include process analysis, construction analysis and defect analysis of ultra-fine-pitch flip chip and bump connections – enabling process improvement for ultra-fine-pitch package and back-end-of-line (BEOL) interconnects. Xradia 800 Ultra enables visualization of the texture and volume of solder consumed by intermetallic compounds in fine-pitch copper pillar microbumps. Defect sites are preserved during imaging, enabling targeted follow-up analysis by a variety of techniques. The construction quality of blind assemblies, such as wafer-to-wafer bonded interconnect and direct hybrid bonding, can be characterized in 3D. Features include:

  • 150 nm and 50 nm spatial resolution (sample preparation is required)
  • Optional pico-second laser sample prep tool, enabling extraction of an intact volume sample (typically 100 microns in diameter) in under one hour
  • Compatibility with a wide range of options for follow-on analysis, including transmission electronic microscopy (TEM), energy dispersive X-ray spectroscopy (EDS), atomic force microscopy (AFM), secondary ion mass spectroscopy (SIMS) and nanoprobing

Xradia Context microCT is a new submicron-resolution 3D X-ray microCT system based on the Versa platform. It is designed for high-resolution imaging of packages at short working distances with high throughput. Features include:

  • Large field of view for full-field imaging of large samples (10x greater volume compared to the Xradia Versa XRM system)
  • High-speed 6-megapixel detector with small pixel size maintains resolution at even relatively large fields of view
  • X-ray microCT with 0.95 micron spatial resolution, 0.5 micron min voxel size
  • Excellent image quality and contrast
  • Field convertible to Xradia Versa, enabling RaaD capability and high-resolution imaging of intact larger samples

ZEISS will showcase its latest microscopy products and solutions for semiconductor manufacturing – including the new Xradia 600-series Versa, Xradia 800 Ultra and Xradia Context microCT systems – at SEMICON Korea, to be held January 23-25 at the COEX Convention and Exhibition Center in Seoul, Korea. Attendees interested in learning more can visit ZEISS at Booth D520.

For more information on these new 3D X-ray imaging solutions from ZEISS, please visit: www.zeiss.com/pcs

 

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