Company’s advanced sensor platform provides market-leading imaging and non-imaging technology solutions with high performance, reliability and accuracy
MIGDAL HAEMEK, Israel, July 22, 2020 –Tower Semiconductor (NASDAQ/TASE: TSEM), the leader in high-value analog semiconductor foundry solutions, today announced its participation at The Virtual Sensor Show & Congress 2020 and its online presentation, “IoT Sensors for The Industrial and Harsh Environments” presented by Mr. AJ ElJallad, Senior Sales Director of Sensors & Displays Business Unit on July 23, 2020 at 15:10 CET as part of the IoT, Industrial & Manufacturing session (track B).
The presentation will show how our advanced devices can be integrated on conventional CMOS platforms to create highly differentiated environmental, radiation, and magnetic sensors that are scalable in feature, highly efficient, ultra-miniature, cost competitive, and suitable for applications operating in harsh environments, exposed to various gasses, chemicals, moisture, and high temperature in systems that require high reliability and accuracy. The session will discuss the platform’s distinctive capabilities, including the embedding of AI circuits and smart sensing for enhanced automation and IoT communication to the cloud on the same chip. In addition, it will specifically cover how these highly flexible platforms’ features can be utilized for various radiation monitoring applications such as monitoring of UV based sterilization as required, for example, at present times for COVID-19 needs.
Tower Semiconductor provides a broad range of best-in-class non-imaging sensor technology solutions and IPs addressing the complex, extensive and dynamic sensing needs rising in today’s global markets including the industrial, medical, automotive, and consumer industries. The Company offers technological platforms for fabricating diverse sensing devices, including unique ionizing radiation, UV and magnetic field sensors. These platforms enable incorporating the device application on the Company’s well-established CMOS processes, allowing the sensing functionality to be embedded directly into a SoC architecture, providing ultra-low power design and fabrication of devices for the environment, while maintaining outstanding sensitivity and reliability.
For more information about The Virtual Sensor Show and Congress, agenda, and attending Tower’s online presentation, please visit the event’s website.
For more information about Tower Semiconductor’s Non-Imaging technology solutions, please click here.
For more information about Tower Semiconductor’s process technology offerings, please click here
About Tower Semiconductor
Tower Semiconductor Ltd. (NASDAQ: TSEM, TASE: TSEM), the leader in high-value analog semiconductor foundry solutions, provides technology and manufacturing platforms for integrated circuits (ICs) in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor focuses on creating positive and sustainable impact on the world through long term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, integrated power management (BCD and 700V), and MEMS. Tower Semiconductor also provides world-class design enablement for a quick and accurate design cycle as well as Transfer Optimization and development Process Services (TOPS) to IDMs and fabless companies. To provide multi-fab sourcing and extended capacity for its customers, Tower Semiconductor operates two manufacturing facilities in Israel (150mm and 200mm), two in the U.S. (200mm) and three facilities in Japan (two 200mm and one 300mm) through TPSCo. For more information, please visit www.towersemi.com.
Safe Harbor Regarding Forward-Looking Statements
This press release includes forward-looking statements, which are subject to risks and uncertainties. Actual results may vary from those projected or implied by such forward-looking statements. A complete discussion of risks and uncertainties that may affect the accuracy of forward-looking statements included in this press release or which may otherwise affect Tower’s business is included under the heading “Risk Factors” in Tower’s most recent filings on Forms 20-F, F-3, F-4 and 6-K, as were filed with the Securities and Exchange Commission (the “SEC”) and the Israel Securities Authority. Tower does not intend to update, and expressly disclaim any obligation to update, the information contained in this release.
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