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Lift & Co. Announces Date for its Fourth Quarter Fiscal 2019 Results Conference Call

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TORONTO, June 12, 2019 (GLOBE NEWSWIRE) — Lift & Co. Corp. (“Lift & Co.” or the “Company”) is pleased to announce that it will report its financial results for the year ended March 31, 2019 on Monday, June  24, 2019 before market open. The Company will subsequently hold a conference call and webcast on the same day at 1:00 pm Eastern Time hosted by Matei Olaru, Chief Executive Officer, and Kasia Malz, Chief Financial Officer. A question and answer session will follow.

Conference Call Details:

Date: Monday, June 24, 2019
Time: 1:00 PM Eastern Time

Participant Dial-in Numbers: 
Local – (+1) 866-211-3050
International – (+1) 647-689-6572
Conference ID: 5787828

Webcast Registration:
https://event.on24.com/wcc/r/2027833-1/2751119DF49B463A192B7B9D478187E5

Recording Playback Numbers:
Local – (+1) 416-621-4642
Toll Free – (+1) 800-585-8367
Expiry Date: July 24, 2019 11:59 PM

Please connect at least 15 minutes prior to the conference call to ensure time for any software download that may be needed to hear the webcast.

About Lift & Co.
Lift & Co. (TSXV: LIFT) is a publicly-traded technology company modernizing the cannabis industry.

Forward-looking statements 
Neither TSX Venture Exchange nor its Regulation Services Provider (as that term is defined in the policies of the TSX Venture Exchange) accept responsibility for the adequacy or accuracy of this release.

Although the Company has attempted to identify important factors that could cause actual results, performance or achievements to differ materially from those contained in the forward-looking statements, there can be other factors that cause results, performance or achievements not to be as anticipated, estimated or intended.

There can be no assurance that such forward-looking statements will prove to be accurate or that management’s expectations or estimates of future developments, circumstances or results will materialize. Accordingly, readers should not place undue reliance on forward-looking statements. The forward-looking statements in this news release are made as of the date of this release. The Company disclaims any intention or obligation to update or revise such information, except as required by applicable law, and the Company does not assume any liability for disclosure relating to any other company mentioned herein.

SOURCE Lift & Co. Corp.

For further information:
Lift & Co.
Sara McMillen, Director Communications and Government Relations, Lift & Co.
smcmillen@lift.co
1-416-220-9536

Investor Relations:
Thesis Capital
Prit Singh, 905-510-7636, psingh@thesiscapital.ca

GlobeNewswire is one of the world's largest newswire distribution networks, specializing in the delivery of corporate press releases financial disclosures and multimedia content to the media, investment community, individual investors and the general public.

IT Industry

eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects

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The PHY supports 2.5D applications such as silicon interposers and silicon bridges for system-on-chip (SoC) to chiplets and SoC partitioning

SAN JOSE, Calif., Sept. 22, 2019 (GLOBE NEWSWIRE) — eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today its 7nm high-bandwidth interconnect (HBI™)+ physical interface (PHY) IP is available to be licensed for inclusion in customer designs. This special-purpose hard IP block delivers a high-bandwidth, low-power and low-latency wide-parallel, clock-forwarded PHY interface for 2.5D applications including system-on-chip (SoC) to chiplets and SoC partitioning for complex subsystems. Silicon interposer and silicon bridge technologies are supported.

eSilicon’s HBI+ PHY delivers a data rate of up to 4.0Gbps per pin. Flexible configurations include up to 80 receive and 80 transmit connections per channel and up to 24 channels per PHY with one redundant lane per channel to improve production yields. The part also supports built-in self-test (BIST), internal loopback and external PHY-to-PHY link tests. Standards supported include IEEE 1149.1 (JTAG) and 1149.6 (AC JTAG) boundary scan.

“eSilicon has a rich history of developing high-performance, high-bandwidth interconnect IP, from long-reach SerDes to die-to-die interconnect,” said Hugh Durdan, vice president, strategy and products at eSilicon. “This new HBI+ PHY will help to enable a growing chiplet ecosystem that is supported by many new and innovative technologies.”

The prior version of this PHY (HBI, 2.5 Gbps per pin) was used successfully on a customer ASIC at 14nm. eSilicon is currently in design with a major customer ASIC in 7nm using the HBI+ PHY.

To learn more about eSilicon’s 7nm and 5nm HBI+ PHY capabilities, you can visit its HBI web page or contact your eSilicon sales representative directly or via sales@esilicon.com.

About eSilicon
eSilicon provides complex FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Our ASIC-proven, differentiating IP includes highly configurable 7nm 56G/112G SerDes plus networking-optimized 16/14/7nm FinFET IP platforms featuring HBM2 PHY, TCAM, specialized memory compilers and I/O libraries. Our neuASIC platform provides AI-specific IP and a modular design methodology to create adaptable, highly efficient AI ASICs. eSilicon serves the high-bandwidth networking, high-performance computing, AI and 5G infrastructure markets. www.esilicon.com

Collaborate. Differentiate. Win.™

eSilicon is a registered trademark, and the eSilicon logo, neuASIC, HBI and “Collaborate. Differentiate. Win.” are trademarks, of eSilicon Corporation. Other trademarks are the property of their respective owners.

Contacts:  
Sally Slemons Nanette Collins
eSilicon Corporation Public Relations for eSilicon
sslemons@esilicon.com nanette@nvc.com
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IT Industry

Constellation Software Announces Appointment of Susan Gayner and Dexter Salna to its Board of Directors

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TORONTO, Sept. 20, 2019 (GLOBE NEWSWIRE) — The board of directors of Constellation Software Inc. (“Constellation”) (TSX: CSU) announced today the appointment of Susan Gayner and Dexter Salna to the Company’s Board of Directors.

Susan Gayner is President and CEO of ParkLand Ventures, Inc., an owner-operator of multifamily housing communities in the US.  She is a Chemical Engineer by training and prior to her tenure with ParkLand served in various capacities with both the DuPont Company and Hercules, Inc.  She currently serves on the board of directors of Synalloy Corporation, where she is chair of the Governance Committee.  She holds a BA (Chemistry) and an ME (Chemical Engineering), both from the University of Virginia.

Dexter Salna joined Constellation in 1995 and is currently the President of the Perseus operating group within Constellation.  Prior to his current position, Mr. Salna held various senior executive positions within the Volaris operating group of Constellation.

About Constellation Software Inc.
Constellation Software acquires, manages and builds vertical market software businesses

Contact:

Jamal Baksh
Chief Financial Officer
416-861-9677

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IT Industry

dynaCERT Provides Clarification-Retraction

GlobeNewswire

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TORONTO, Sept. 20, 2019 (GLOBE NEWSWIRE) — dynaCERT Inc. (TSX VENTURE: DYA) (OTCQB: DYFSF) (FRA: DMJ) announces the following:

IIROC has requested disclosure from dynaCERT (and dynaCERT wishes to comply) that dynaCERT does not endorse the “BUY” recommendation nor the target price previously announced in a press release today regarding the independent research report produced by the Investment Research department of GBC AG.  Such research report was not paid for by dynaCERT and is considered independent of the Company.

About dynaCERT Inc.

dynaCERT Inc. manufactures and distributes Carbon Emission Reduction Technology for use with internal combustion engines. As part of the growing global hydrogen economy, our patented technology creates hydrogen and oxygen on-demand through a unique electrolysis system and supplies these gases through the air intake to enhance combustion, resulting in lower carbon emissions and greater fuel efficiency. Our technology is designed for use with many types and sizes of diesel engines used in on-road vehicles, reefer trailers, off-road construction, power generation, mining and forestry equipment, marine vessels and railroad locomotives. Website: www.dynaCERT.com

READER ADVISORY

Except for statements of historical fact, this news release contains certain “forward-looking information” within the meaning of applicable securities law. Forward-looking information is frequently characterized by words such as “plan”, “expect”, “project”, “intend”, “believe”, “anticipate”, “estimate” and other similar words, or statements that certain events or conditions “may” or “will” occur. In particular, forward-looking information in this press release includes, but is not limited to the potential expansion into new markets, industries and segments, such as diesel-powered use of any the dynaCERT products and sales. Although we believe that the expectations reflected in the forward-looking information are reasonable, there can be no assurance that such expectations will prove to be correct. We cannot guarantee future results, performance of achievements. Consequently, there is no representation that the actual results achieved will be the same, in whole or in part, as those set out in the forward-looking information.

Forward-looking information is based on the opinions and estimates of management at the date the statements are made, and are subject to a variety of risks and uncertainties and other factors that could cause actual events or results to differ materially from those anticipated in the forward-looking information. Some of the risks and other factors that could cause the results to differ materially from those expressed in the forward-looking information include, but are not limited to: uncertainty as to whether our strategies and business plans will yield the expected benefits; availability and cost of capital; the ability to identify and develop and achieve commercial success for new products and technologies; the level of expenditures necessary to maintain and improve the quality of products and services; changes in technology and changes in laws and regulations; the uncertainty of the emerging hydrogen economy; including the hydrogen economy moving at a pace not anticipated; our ability to secure and maintain strategic relationships and distribution agreements; and the other risk factors disclosed under our profile on SEDAR at www.sedar.com. Readers are cautioned that this list of risk factors should not be construed as exhaustive.

The forward-looking information contained in this news release is expressly qualified by this cautionary statement. We undertake no duty to update any of the forward-looking information to conform such information to actual results or to changes in our expectations except as otherwise required by applicable securities legislation. Readers are cautioned not to place undue reliance on forward-looking information.

Neither TSX Venture Exchange nor its Regulation Services Provider (as that term is defined in the policies of the TSX Venture Exchange) accepts responsibility for the adequacy or accuracy of the release.

On Behalf of the Board
Murray James Payne, CEO

For more information, please contact:

Jim Payne, CEO & President
dynaCERT Inc.
#101 – 501 Alliance Avenue
Toronto, Ontario M6N 2J1
+1 (416) 766-9691 x 2
jpayne@dynaCERT.com

Investor Relations
dynaCERT Inc.
Nancy Massicotte
+1 (416) 766-9691 x 1
ir@dynaCERT.com

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