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iQIYI Releases Vertical Video Drama Series “Ugh! Life!”

Zoltán Tűndik

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Photo source: scmp.com
Reading Time: 2 minutes

Ugh! Life! is a new comedy series adapted especially for portrait mode mobile viewing

iQIYI Inc. (NASDAQ: IQ) (“iQIYI” or the “Company”), an innovative market-leading online entertainment service in China, today announced the release of China’s first vertical video drama series Ugh!Life!, which is set to premiere on November 26. The release of the show, a comedy consisting of 48 episodes of 3 minutes, is a part of iQIYI’s strategy to begin producing professional level content design for portrait mode viewing on mobile devices.

Watching video content on mobile devices is increasingly becoming the norm rather than the exception, with entertainment content producers and platforms globally striving to adapt to these new viewing habits. As such, “vertical video”, referring to video content designed to be watched using a phone’s vertical portrait mode, has become a hot topic across the entertainment industry. With the release of Ugh! Life! and last month’s vertical short video stand-up comedy megagame, iQIYI is the first entertainment service in China to significantly invest in this disruptive new format.

“We are thrilled to announce the premiere of our vertical video drama series Ugh! Life!, which we believe is one of our most innovative projects yet,” said Fu Tuo, Chief Producer of iQIYI Wright Studio. “With this project, iQIYI is not only offering our viewers a fresh new format but transforming the traditional approach to online content consumption, pushing forward development in the Chinese online entertainment industry.”

At iQIYI’s iJOY conference in Shanghai earlier this month, iQIYI CEO and founder Gong Yu stated that according to research, 70% of users view content on their phone in portrait mode. Dr. Gong predicted that the vertical video will soon become a mainstream method of content consumption, changing from being confined to largely grassroots, user-made video and expanding to include professional level content.

As a leader in China’s entertainment industry, iQIYI is committed to innovating not only in terms of content matter but also in the way that content is presented. Recently, the company announced that going forward it will focus its effort on online dramas which total 12 episodes or less per season, a format shown to increase user loyalty. A previously produced online drama, Burning Ice, which has 12 episodes per season, was released last year by iQIYI to critical acclaim, being selected for distribution by Netflix and being recognized with an award for “Best Chinese Online Drama” at Chinese American Film and TV Festival.

Co-founder, Editor - After accumulating enough experience by launching and building a successful media and events organizer company in the gaming industry, the opportunity to also move into more verticals just came naturally. I have hunger for knowledge and like to report on technology and news that are not picked up by main stream media channels because they don't produce enough emotions. Make sure you subscribe to read our hand picked news which you will only find on PICANTE!

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Computer Electronics

Vivo’s Elevating Front Camera is a Game Changer

Vlad Poptamas

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Captured from Vivo’s video about Elevating Front Camera - Source: Vivo
Reading Time: 1 minute

 

Vivo has had a fantastic year of launching true innovations in 2018. The company has recently published a video to showcase its industry-leading innovative solution — the Elevating Front Camera.

In the past, brands have tried shaving the side bezels and minimizing the size of the notch to achieve a full-screen display, but still the notch remains. For Vivo, it started to explore ways to breakthrough this status quo, aiming to create a bezel-less phone display experience for the consumers.

After years of researching and testing various designs, Vivo presented the APEX™ FullView™ concept smartphone with the iconic Elevating Front Camera at MWC 2018. The challenge for Vivo, was then to turn this concept phone, into a reality.

Just 4 months after the debut at MWC, Vivo delivered its promise to make the bezel-less dream come true with NEX – the first mass-produced smartphone with an Elevating Front Camera. This is a small periscopic camera that pops up when taking selfies, and retracts automatically when the user exits selfie mode. The true bezel-less phone was finally achieved.

Vivo has rewritten the rules of the smartphone industry by completely scraping the notch with this groundbreaking invention. With such an impressive technology now made available to consumers, Vivo is sure to take the Elevating Front Camera a step further in 2019.

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Computer Electronics

ZEISS Launches New High-resolution 3D X-ray Imaging Solutions for Advanced Semiconductor Packaging Failure Analysis

Vlad Poptamas

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Xradia 600-series Versa 3D X-ray Microscope
Reading Time: 4 minutes

 

New submicron and nanoscale XRM systems and new microCT system provide flexible options for implementing failure analysis to accelerate development and to improve assembly yields of advanced semiconductor packages

ZEISS today unveiled a new suite of high-resolution 3D X-ray imaging solutions for failure analysis (FA) of advanced semiconductor packages, including 2.5/3D and fan-out wafer-level packages. The new ZEISS systems include the Xradia 600-series Versa and Xradia 800 Ultra X-ray microscopes (XRM) for submicron and nanoscale package FA, respectively, as well as the new Xradia Context microCT. With the addition of these new systems to its existing family of products, ZEISS now provides the broadest portfolio of 3D X-ray imaging technologies serving the semiconductor industry.

“Throughout its 170-year history, ZEISS has pushed the frontiers of scientific research and advanced the start-of-the-art in imaging technologies to enable new industrial applications and technological innovations,” stated Dr. Raj Jammy, president, ZEISS Process Control Solutions (PCS) and Carl Zeiss SMT, Inc. “Now more than ever in the semiconductor industry, where package as well as device features are shrinking in all three dimensions, new imaging solutions are needed to quickly isolate failures in order to enable higher package yields. We are extremely pleased to announce this trio of new 3D X-ray imaging solutions for advanced semiconductor packaging, which provides our customers with a powerful high-resolution toolset to improve their failure analysis success rates.”

Advanced Packaging Requires New Defect Detection and Failure Analysis Methods
As the semiconductor industry approaches the limits of CMOS scaling, semiconductor packaging needs to help bridge the performance gap. To continue producing ever-smaller and faster devices with lower power requirements, the semiconductor industry is turning to package innovation through 3D stacking of chips and other novel packaging formats. This drives increasingly complex package architectures and new manufacturing challenges, along with increased risk of package failures. Furthermore, since the physical location of failures is often buried within these complex 3D structures, conventional methods for visualizing failure locations are becoming less effective. New techniques are required to efficiently isolate and determine the root cause of failures in these advanced packages.

To address these needs, ZEISS has developed a new suite of 3D X-ray imaging solutions that provides submicron and nanoscale 3D images of features and defects buried within intact structures in advanced package 3D architectures. This is enabled by rotating a sample and capturing a series of 2D X-ray images from different perspectives, followed by reconstruction of 3D volumes using sophisticated mathematical models and algorithms. An unlimited number of virtual cross-sections of the 3D volume may be viewed from any angle – providing valuable insight of failure locations prior to physical failure analysis (PFA). The combination of submicron and nanoscale XRM solutions from ZEISS provides a unique FA workflow that can significantly enhance FA success rates. ZEISS’s new Xradia Context microCT offers high contrast and resolution in a large field of view, using projection-based geometric magnification, and is fully upgradable to Xradia Versa.

New Imaging Solutions in Detail
Xradia 600-series Versa
is the next generation of 3D XRM for non-destructive imaging of localized defects within intact advanced semiconductor packages. It excels in structural and FA applications for process development, yield improvement and construction analysis. Based on the award-winning Versa platform with Resolution at a Distance (RaaD) capability, Xradia 600-series Versa offers unsurpassed performance for high-resolution imaging of larger samples at long working distances to determine root causes of defects and failures in packages, circuit boards and 300 mm wafers. It can easily visualize defects associated with package-level failures, such as cracks in bumps or microbumps, solder wetting problems or through silicon via (TSV) voids. The 3D visualization of defects prior to PFA reduces artifacts and guides cross-section orientations, leading to improved FA success rates. Features include:

  • 0.5 micron spatial resolution, 40 nm min voxel size
  • Up to 2x higher throughput than Xradia 500-series Versa, achieved while maintaining high resolution with excellent source spot-size stability and thermal management control across the full kV and power range
  • Improved ease of use, including fast-activation source control
  • Ability to observe submicron structural changes within a package successively imaged at multiple reliability test read points

Xradia 800 Ultra brings 3D XRM to the nanoscale realm, producing images of buried features with nanoscale spatial resolution while preserving the volume integrity of the region of interest. Applications include process analysis, construction analysis and defect analysis of ultra-fine-pitch flip chip and bump connections – enabling process improvement for ultra-fine-pitch package and back-end-of-line (BEOL) interconnects. Xradia 800 Ultra enables visualization of the texture and volume of solder consumed by intermetallic compounds in fine-pitch copper pillar microbumps. Defect sites are preserved during imaging, enabling targeted follow-up analysis by a variety of techniques. The construction quality of blind assemblies, such as wafer-to-wafer bonded interconnect and direct hybrid bonding, can be characterized in 3D. Features include:

  • 150 nm and 50 nm spatial resolution (sample preparation is required)
  • Optional pico-second laser sample prep tool, enabling extraction of an intact volume sample (typically 100 microns in diameter) in under one hour
  • Compatibility with a wide range of options for follow-on analysis, including transmission electronic microscopy (TEM), energy dispersive X-ray spectroscopy (EDS), atomic force microscopy (AFM), secondary ion mass spectroscopy (SIMS) and nanoprobing

Xradia Context microCT is a new submicron-resolution 3D X-ray microCT system based on the Versa platform. It is designed for high-resolution imaging of packages at short working distances with high throughput. Features include:

  • Large field of view for full-field imaging of large samples (10x greater volume compared to the Xradia Versa XRM system)
  • High-speed 6-megapixel detector with small pixel size maintains resolution at even relatively large fields of view
  • X-ray microCT with 0.95 micron spatial resolution, 0.5 micron min voxel size
  • Excellent image quality and contrast
  • Field convertible to Xradia Versa, enabling RaaD capability and high-resolution imaging of intact larger samples

ZEISS will showcase its latest microscopy products and solutions for semiconductor manufacturing – including the new Xradia 600-series Versa, Xradia 800 Ultra and Xradia Context microCT systems – at SEMICON Korea, to be held January 23-25 at the COEX Convention and Exhibition Center in Seoul, Korea. Attendees interested in learning more can visit ZEISS at Booth D520.

For more information on these new 3D X-ray imaging solutions from ZEISS, please visit: www.zeiss.com/pcs

 

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Banking/Financial Services

OKEx Launches Thai Baht (THB) and British Pound (GBP) OTC Trading

Vlad Poptamas

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OKEx Launches Thai Baht (THB) and British Pound (GBP) OTC Trading - Source: OKEx
Reading Time: 2 minutes

 

OKEx, the Malta-based world-leading digital asset exchange, announced to launch two new currencies – Thai Baht (THB) and British Pound (GBP) on its over-the-counter (OTC) trading platform (also referred to as fiat-to-cryptocurrency platform). Users in Thailand and the United Kingdom can now complete KYC verification to be eligible to trade on the OTC trading platform.

OKEx OTC trading allows users to place orders with self-selected exchange rate and payment methods to buy or sell Virtual Financial Assets with fiat currencies, which benefits them by offering a low-volatility market and zero transaction fee. Instead of the listing of the new currencies, Thai Baht (THB) and British Pound (GBP), OKEx OTC trading platform has already been facilitating global digital assets trading with the Vietnamese Dong (VND) and Chinese Renminbi (CNY) fiat-to-cryptocurrency markets, and more currencies are expected to come in at a later time this year. The Thai Baht (THB) and British Pound (GBP) OTC trading markets currently support BTC, USDT, ETH, and LTC.

“Our mission is simple at OKEx. We aim to offer flexibility and convenience to our traders. Thailand and the UK own the fastest growing crypto communities in the world. We see great potential in these two markets and want to support the needs there. Because of the increasing trading volume and number of traders in these two countries, we decided to launch the new THB and GBP trading services on our OTC trading platform. Wherever the market potential locates, we will expand to there. In 2019, you can expect more currencies will be supported on OKEx,” said Andy Cheung, OKEx’s Head of Operations.

OKEx OTC Network Launch Events and Promotions

To celebrate the launch, OKEx has come up with new incentives to encourage new sign-up for merchants and customers in Thailand and the UK. From January 23 to 27, newly registered customers can earn up to 50 USDT for making a minimum deposit of 100 USDT (or equivalent) and complete their first OTC transaction on OKEx, while the top 70 merchants with the most transaction volume will be rewarded 30 USDT (1 time per day).

In addition, the OKEx OTC Network Launch events will be hosted in Bangkok, Thailand on February 13, 2019 and London, UK in March respectively.

For more details, please refer to OKEx Twitter.

Risk Warning: Trading digital assets involves significant risk and can result in the loss of invested capital. Users should ensure that they fully understand the risk involved and take into consideration their level of experience, investment objectives and seek independent financial advice if necessary.

 

 

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