TEMPE, Ariz.–(BUSINESS WIRE)–Amkor Technology, Inc. (NASDAQ: AMKR), a leading provider of
semiconductor packaging and test services, today announced that it will
participate in Baird’s 2019 Consumer, Technology and Services Conference
on Tuesday, June 4, 2019. Amkor’s presentation will occur at 7:55 am
Eastern Time (4:55 am Pacific Time) at the InterContinental New York
Barclay, in New York, NY.
An audio-only webcast of the presentation will be made available, both
live and by replay, on the Investor Relations section of Amkor’s website.
About Amkor Technology, Inc.
Amkor Technology, Inc. is one of the world’s largest providers of
outsourced semiconductor packaging and test services. Founded in 1968,
Amkor pioneered the outsourcing of IC packaging and test, and is now a
strategic manufacturing partner for more than 250 of the world’s leading
semiconductor companies, foundries and electronics OEMs. Amkor’s
operational base includes production facilities, product development
centers, and sales and support offices located in key electronics
manufacturing regions in Asia, Europe and the USA. For more information,
visit www.amkor.com.
Contacts
Amkor Technology, Inc.
Vincent Keenan
Vice President, Investor
Relations
480-786-7594
[email protected]
